Snapdragon 845

About this

This document describes the information about Qualcomm Snapdragon 845 supported boards and it’s usage steps.

SDM845 - hi-end qualcomm chip, introduced in late 2017. Mostly used in flagship phones and tablets of 2018.

U-Boot can be used as a replacement for Qualcomm’s original ABL (UEFI) bootloader. It is loaded as an Android boot image through ABL



Setup CROSS_COMPILE for aarch64 and build U-Boot for your board:

$ export CROSS_COMPILE=<aarch64 toolchain prefix>
$ make <your board name here, see Boards section>_defconfig
$ make

This will build u-boot.bin in the configured output directory.

Generate FIT image

See doc/uImage.FIT for more details

Pack android boot image

We’ll assemble android boot image with u-boot.bin instead of linux kernel, and FIT image instead of initramfs. Android bootloader expect gzipped kernel with appended dtb, so let’s mimic linux to satisfy stock bootloader:

  • create dump dtb:

    mkdir -p "$workdir"
    cd "$workdir"
    dtc -I dts -O dtb -o "$mock_dtb" << EOF
    / {
            memory {
                    /* We expect the bootloader to fill in the size */
                    reg = <0 0 0 0>;
            chosen { };
  • gzip u-boot gzip u-boot.bin

  • append dtb to gzipped u-boot: cat u-boot.bin.gz "$mock_dtb" > u-boot.bin.gz-dtb

Now we’ve got everything to build android boot image::

mkbootimg --base 0x0 --kernel_offset 0x00008000 \
--ramdisk_offset 0x02000000 --tags_offset 0x01e00000 \
--pagesize 4096 --second_offset 0x00f00000 \
--ramdisk "$fit_image" \
--kernel u-boot.bin.gz-dtb \
-o boot.img

Flash image with your phone’s flashing method.



The starqltechn is a production board for Samsung S9 (SM-G9600) phone, based on the Qualcomm SDM845 SoC.

More information can be found on the Samsung S9 page.