AM62 Platforms

Introduction:

The AM62 SoC family is the follow on AM335x built on the K3 Multicore SoC architecture platform, providing ultra-low-power modes, dual display, multi-sensor edge compute, security and other BOM-saving integrations. The AM62 SoC targets a broad market to enable applications such as Industrial HMI, PLC/CNC/Robot control, Medical Equipment, Building Automation, Appliances and more.

Some highlights of this SoC are:

  • Quad-Cortex-A53s (running up to 1.4GHz) in a single cluster. Pin-to-pin compatible options for single and quad core are available.

  • Cortex-M4F for general-purpose or safety usage.

  • Dual display support, providing 24-bit RBG parallel interface and OLDI/LVDS-4 Lane x2, up to 200MHz pixel clock support for 2K display resolution.

  • Selectable GPU support, up to 8GFLOPS, providing better user experience in 3D graphic display case and Android.

  • PRU(Programmable Realtime Unit) support for customized programmable interfaces/IOs.

  • Integrated Giga-bit Ethernet switch supporting up to a total of two external ports (TSN capable).

  • 9xUARTs, 5xSPI, 6xI2C, 2xUSB2, 3xCAN-FD, 3x eMMC and SD, GPMC for NAND/FPGA connection, OSPI memory controller, 3xMcASP for audio, 1x CSI-RX-4L for Camera, eCAP/eQEP, ePWM, among other peripherals.

  • Dedicated Centralized System Controller for Security, Power, and Resource Management.

  • Multiple low power modes support, ex: Deep sleep, Standby, MCU-only, enabling battery powered system design.

More details can be found in the Technical Reference Manual: https://www.ti.com/lit/pdf/spruiv7

Platform information:

Boot Flow:

Below is the pictorial representation of boot flow:

Boot flow diagram
  • Here TIFS acts as master and provides all the critical services. R5/A53 requests TIFS to get these services done as shown in the above diagram.

Sources:

Note

The TI Firmware required for functionality of the system can be one of the following combination (see platform specific boot diagram for further information as to which component runs on which processor):

  • TIFS - TI Foundational Security Firmware - Consists of purely firmware meant to run on the security enclave.

  • DM - Device Management firmware also called TI System Control Interface server (TISCI Server) - This component purely plays the role of managing device resources such as power, clock, interrupts, dma etc. This firmware runs on a dedicated or multi-use microcontroller outside the security enclave.

OR

  • SYSFW - System firmware - consists of both TIFS and DM both running on the security enclave.

Build procedure:

  1. Setup the environment variables:

Generic environment variables

S/w Component

Env Variable

Description

All Software

CC32

Cross compiler for ARMv7 (ARM 32bit), typically arm-linux-gnueabihf-

All Software

CC64

Cross compiler for ARMv8 (ARM 64bit), typically aarch64-linux-gnu-

All Software

LNX_FW_PATH

Path to TI Linux firmware repository

All Software

TFA_PATH

Path to source of Trusted Firmware-A

All Software

OPTEE_PATH

Path to source of OP-TEE

Board specific environment variables

S/w Component

Env Variable

Description

U-Boot

UBOOT_CFG_CORTEXR

Defconfig for Cortex-R (Boot processor).

U-Boot

UBOOT_CFG_CORTEXA

Defconfig for Cortex-A (MPU processor).

Trusted Firmware-A

TFA_BOARD

Platform name used for building TF-A for Cortex-A Processor.

Trusted Firmware-A

TFA_EXTRA_ARGS

Any extra arguments used for building TF-A.

OP-TEE

OPTEE_PLATFORM

Platform name used for building OP-TEE for Cortex-A Processor.

OP-TEE

OPTEE_EXTRA_ARGS

Any extra arguments used for building OP-TEE.

Set the variables corresponding to this platform:

export CC32=arm-linux-gnueabihf-
export CC64=aarch64-linux-gnu-
export LNX_FW_PATH=path/to/ti-linux-firmware
export TFA_PATH=path/to/trusted-firmware-a
export OPTEE_PATH=path/to/optee_os
export UBOOT_CFG_CORTEXR=am62x_evm_r5_defconfig
export UBOOT_CFG_CORTEXA=am62x_evm_a53_defconfig
export TFA_BOARD=lite
# we dont use any extra TFA parameters
unset TFA_EXTRA_ARGS
export OPTEE_PLATFORM=k3-am62x
export OPTEE_EXTRA_ARGS="CFG_WITH_SOFTWARE_PRNG=y"
  1. Trusted Firmware-A:

# inside trusted-firmware-a source
make CROSS_COMPILE=$CC64 ARCH=aarch64 PLAT=k3 SPD=opteed $TFA_EXTRA_ARGS \
     TARGET_BOARD=$TFA_BOARD
  1. OP-TEE:

# inside optee_os source
make CROSS_COMPILE=$CC32 CROSS_COMPILE64=$CC64 CFG_ARM64_core=y $OPTEE_EXTRA_ARGS \
      PLATFORM=$OPTEE_PLATFORM
  1. U-Boot:

  • 3.1 R5:

# inside u-boot source
make $UBOOT_CFG_CORTEXR
make CROSS_COMPILE=$CC32 BINMAN_INDIRS=$LNX_FW_PATH
  • 3.2 A53:

# inside u-boot source
make $UBOOT_CFG_CORTEXA
make CROSS_COMPILE=$CC64 BINMAN_INDIRS=$LNX_FW_PATH \
       BL31=$TFA_PATH/build/k3/$TFA_BOARD/release/bl31.bin \
       TEE=$OPTEE_PATH/out/arm-plat-k3/core/tee-raw.bin

Note

It is also possible to pick up a custom DM binary by adding TI_DM argument pointing to the file. If not provided, it defaults to picking up the DM binary from BINMAN_INDIRS. This is only applicable to devices that utilize split firmware.

Target Images

In order to boot we need tiboot3.bin, tispl.bin and u-boot.img. Each SoC variant (GP, HS-FS, HS-SE) requires a different source for these files.

  • GP

    • tiboot3-am62x-gp-evm.bin from step 3.1

    • tispl.bin_unsigned, u-boot.img_unsigned from step 3.2

  • HS-FS

    • tiboot3-am62x-hs-fs-evm.bin from step 3.1

    • tispl.bin, u-boot.img from step 3.2

  • HS-SE

    • tiboot3-am62x-hs-evm.bin from step 3.1

    • tispl.bin, u-boot.img from step 3.2

Image formats:

  • tiboot3.bin

tiboot3.bin image format
  • tispl.bin

tispl.bin image format

A53 SPL DDR Memory Layout

This provides an overview memory usage in A53 SPL stage.

Region

Start Address

End Address

EMPTY

0x80000000

0x80080000

TEXT BASE

0x80080000

0x800d8000

EMPTY

0x800d8000

0x80200000

BMP IMAGE

0x80200000

0x80b77660

STACK

0x80b77660

0x80b77e60

GD

0x80b77e60

0x80b78000

MALLOC

0x80b78000

0x80b80000

EMPTY

0x80b80000

0x80c80000

BSS

0x80c80000

0x80d00000

BLOBS

0x80d00000

0x80d00400

EMPTY

0x80d00400

0x81000000

Switch Setting for Boot Mode

Boot Mode pins provide means to select the boot mode and options before the device is powered up. After every POR, they are the main source to populate the Boot Parameter Tables.

The following table shows some common boot modes used on AM62 platform. More details can be found in the Technical Reference Manual: https://www.ti.com/lit/pdf/spruiv7 under the Boot Mode Pins section.

Boot Modes

Switch Label

SW2: 12345678

SW3: 12345678

SD

01000000

11000010

OSPI

00000000

11001110

EMMC

00000000

11010010

UART

00000000

11011100

USB DFU

00000000

11001010

For SW2 and SW1, the switch state in the “ON” position = 1.

Debugging U-Boot

See Common Debugging environment - OpenOCD: for detailed setup information.

Warning

OpenOCD support since: v0.12.0

If the default package version of OpenOCD in your development environment’s distribution needs to be updated, it might be necessary to build OpenOCD from the source.

Integrated JTAG adapter/dongle: The board has a micro-USB connector labelled XDS110 USB or JTAG. Connect a USB cable to the board to the mentioned port.

Note

There are multiple USB ports on a typical board, So, ensure you have read the user guide for the board and confirmed the silk screen label to ensure connecting to the correct port.

To start OpenOCD and connect to the board

openocd -f board/ti_am625evm.cfg